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Publications

  1. A. Contreras; J. Casals-Terre; L. Pradell; F. Giacomozzi; J. Iannacci; M. Ribo,
    in «INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES»,
    2014
    , pp. 1 -
    9
  2. V Mulloni;G Resta;B Margesin,
    Clear evidence of mechanical deformation in RF-MEMS switches during prolonged actuation,
    in «JOURNAL OF MICROMECHANICS AND MICROENGINEERING»,
    vol. 24,
    2014
    , pp. 075003 -
  3. Giacomozzi F.; Mulloni V.; Colpo S.; Faes A. ; Sordo G.; Girardi S.,
    in «MICROSYSTEM TECHNOLOGIES»,
    2014
  4. Casals-Terre J.; Llamas M.A.; Girbau D.; Pradell L.; Lazaro A.; Giacomozzi F.; Colpo S.,
    Analytical Energy Model for the Dynamic Behavior of RF MEMS Switches Under Increased Actuation Voltage,
    in «JOURNAL OF MICROELECTROMECHANICAL SYSTEMS»,
    2014
  5. A. Mortari; A. Adami; L. Lorenzelli,
    An unconventional approach to impedance microbiology: detection of culture media conductivity variations due to bacteriophage generated lyses of host bacteria,
    in «BIOSENSORS & BIOELECTRONICS»,
    2014
  6. A. Mortari; M. Nicolò; A. Adami; S. Guglielmino; L. Lorenzelli,
    Proof of principle of a novel impedance microbiology method based on bacteriophages functionalized paramagnetic nanobeads,
    in «PROCEDIA ENGINEERING»,
    2014
  7. G Baldi;S Battistoni;G Attolini;M Bosi;C Collini;S Iannotta;L Lorenzelli;R Mosca;J S Ponraj;R Verucchi;V Erokhin,
    Logic with memory: and gates made of organic and inorganic memristive devices,
    in «SEMICONDUCTOR SCIENCE AND TECHNOLOGY»,
    vol. 29,
    2014
    , pp. 104009 -
  8. Ravinder S. Dahiya;Andrea Adami;Luigi Pinna;Cristian Collini;Maurizio Valle;Leandro Lorenzelli,
    Tactile Sensing Chips With POSFET Array and Integrated Interface Electronics,
    in «IEEE SENSORS JOURNAL»,
    vol. 14,
    2014
    , pp. 3448 -
    3457
  9. Andrea Lucibello;Romolo Marcelli;Emanuela Proietti;Giancarlo Bartolucci;Viviana Mulloni;Benno Margesin,
    Reliability of RF MEMS capacitive and ohmic switches for space redundancy configurations,
    in «MICROSYSTEM TECHNOLOGIES»,
    2014
  10. Cherman, Vladimir O.; Pham, Nga P.; Slabbekoorn, John; Faes, Alessandro; Margesin, Benno; Tilmans, Harrie A.C.,
    Performance and Perspectives of Zero-Level MEMS Chip Packages with Vertical Interconnects,
    in «JOURNAL OF MICROELECTRONICS AND ELECTRONIC PACKAGING»,
    vol. 11,
    n. 3,
    2014
    , pp. 87 -
    93

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