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Saleem Khan

PhD Student
  • Phone: 0461314686
  • FBK Povo
Short bio

Saleem Khan received his B.S degree in Engineering Sciences with specialization in Lasers and Optoelectronics from GIK institute of Engineering Sciences and Technology, Pakistan in 2007 and received his Master degree in Electronic Engineering from Jeju National University, South Korea in 2010. During his master course his research interests were in development of flexible thin film electronics on plastic substrates employing Electrohydrodynamic Inkjet system. The research work on Master’s level included the development of inkjet nozzle head for getting fine patterns just in one step rather than many steps involved by using Lithography techniques. In manufacturing technologies the development of EHD inkjet head will have a valuable place as it is material efficient and low cost technology. A prototype thin film transistor has been successfully fabricated by following EDH technology during Master’s research work. He joined GIK Institute as a Research Associate in Jan 2011, where he was mainly involved in assisting in various research tasks and teaching specialization courses of Semiconductor and Superconductor stream of final year students. He is currently a PhD student with the University of Trento and his research is based within the BioMEMS group at FBK (Fondazione Bruno Kessler), Trento, Italy under the supervision of Dr. Ravinder Dahiya. His research focus is development of fabrication route for flexible electronics using transfer printing of Si micro/nanostructures on plastic substrates.

Related projects
Publications
  1. Khan, Saleem; Dang, Wenting; Lorenzelli, Leandro; Dahiya, Ravinder,
    in «IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING»,
    2015
  2. Khan, Saleem; Tinku, Sajina; Lorenzelli, Leandro; Dahiya, Ravinder S.,
    in «IEEE SENSORS JOURNAL»,
    vol. 15,
    n. 6,
    2015
    , pp. 3146 -
    3155
  3. Khan, Saleem; Lorenzelli, Leandro; Dahiya, Ravinder S.,
    in «IEEE SENSORS JOURNAL»,
    vol. 15,
    n. 6,
    2015
    , pp. 3164 -
    3185