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Jacopo Iannacci

Researcher
  • Phone: 0461314441
  • FBK Povo
Short bio

The field of expertise of Jacopo Iannacci is in Microsystem Technologies (MEMS) for diverse applications. He received the MSc Degree in Electronic Engineering (2003) and the PhD in Information Technology (2007) from the ARCES Research Center at the University of Bologna, Italy, and worked as Visiting Researcher (2005-2006) at the DIMES Technology Center of the Technical University of Delft, the Netherlands, on the development of packaging and integration solutions for RF-MEMS devices.

He authored and co-authored numerous scientific contributions for international journals and conference proceedings, as well as books and several book chapters in the field of MEMS and RF-MEMS technology.

In 2007 he joined the Research Staff of the Center for Materials and Microsystems (CMM) at Fondazione Bruno Kessler (FBK) in Trento, Italy. Since then he focuses on (compact) modeling, design, optimization, integration, packaging and testing for reliability of MEMS/RF-MEMS devices and networks for Sensors/Actuators, Energy Harvesting and Telecommunication systems and applications.

Research interests
RF-MEMS lumped components RF-MEMS complex networks MEMS-based Energy Harvesters MEMS Sensors and Actuators
Publications
  1. Iannacci, J.; Gaddi, R.; Gnudi, A.,
    Non-Linear Electromechanical RF Model of a MEMS Varactor Based on VerilogA and Lumped Element Parasitic Network,
    Proceedings of the 37th European Microwave Conference (EuMC),
    EuMA,
    2007
    , pp. 544-
    547
    , (37th European Microwave Conference (EuMC),
    Munich, Germany,
    October)
  2. Iannacci, J.; Tian, J.; Gaddi, R.; Gnudi, A.; Bartek, M.,
    A Fully-Parameterized FEM Model for Electromagnetic Optimization of an RF-MEMS Wafer-Level Package,
    Proceedings of the Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2007),
    EDA Publishing, Grenoble, France,
    2007
    , pp. 320-
    325
    , (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2007),
    Stresa, Italy,
    April)
  3. Tin, L. Del; Iannacci, J.; Gaddi, R.; Gnudi, A.; Rudny, E. B.; Greiner, A.; Korvink, J. G.,
    Non Linear Compact Modeling of RE-MEMS Switches by Means of Model Order Reduction,
    Proceedings of Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS 2007,
    IEEE,
    2007
    , pp. 635-
    638
    , (Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS 2007,
    Lyon, France,
    June)
  4. Iannacci, J.; Tian, J.; Akhnoukh, A.; Bartek, M.; Gaddi, R.; Gnudi, A.,
    Electrical Performance Assessment and Optimization of an RF MEMS Wafer Level Package,
    Proceedings 9th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE 2006),
    Utrecht,
    publ. STW (Utrecht),
    2006
    , pp. 512-
    518
    , (9th Annual Workshop on Semiconductor Advances for Future Electronics and Sensors (SAFE 2006),
    Veldhoven, the Netherlands,
    November)
  5. Iannacci, J.; Bartek, M.,
    RF Behaviour of Anisotropic Conductive Adhesive in Wafer Level Packaging for RF MEMS,
    Technical Digest of the 17th Micromechanics Europe Workshop (MME 2006),
    publ. University of Southampton,
    2006
    , pp. 93-
    96
    , (17th Micromechanics Europe Workshop (MME 2006),
    Southampton, UK,
    September)
  6. Iannacci, J.; Tian, J.; Sinaga, S. M.; Gaddi, R.; Gnudi, A.; Bartek, M.,
    Electrical Optimization of a Wafer-Level Package for RF-MEMS Applications,
    Proceedings of the 4th European Microelectronic and Packaging Symposium with Table-Top Exhibition (EMPS 2006),
    publ. MIDEM (Ljubljana),
    2006
    , pp. 79-
    84
    , (European Microelectronic and Packaging Symposium with Table-Top Exhibition (EMPS 2006),
    Terme Catez, Slovenia,
    May)
  7. Iannacci, J.; Tian, J.; Sinaga, S. M.; Gaddi, R.; Gnudi, A.; Bartek, M.,
    Parasitic Effects Reduction for Wafer-Level Packaging of RF-MEMS,
    Proc. of DTIP 2006 (Symposium on Design, Test, Integration and Packaging of MEMS / MOEMS),
    TIMA,
    2006
    , pp. 1-
    6
    , (DTIP 2006 (Symposium on Design, Test, Integration and Packaging of MEMS / MOEMS),
    Stresa, Italy,
    April)
  8. Tian, J.; Iannacci, J.; Sosin, S.; Gaddi, R.; Bartek, M.,
    RF-MEMS Wafer-Level Packaging Using Through-Wafer Via Technology,
    Proceedings of the 8th Electronics Packaging Technology Conference (EPTC 2006),
    IEEE,
    vol.2,
    2006
    , pp. 441-
    447
    , (8th Electronics Packaging Technology Conference (EPTC 2006),
    Singapore,
    December)
  9. Gaddi, R.; Gnudi, A.; Franchi, E.; Bellei, M.; Tin, L. Del; Iannacci, J.; Tortori, P.; Guermandi, D.; Margesin, B.; Giacomozzi, F.,
    Reconfigurable RF-MEMS LC-tanks for multi-band radiofrequency oscillators,
    Proceedings of the Wireless Reconfigurable Terminals and Platforms Workshop (WiRTeP),
    2006
    , pp. 83-
    87
    , (Wireless Reconfigurable Terminals and Platforms Workshop (WiRTeP),
    Rome, Italy,
    April)
  10. Tian, J.; Bartek, M.; Iannacci, J.; Burghartz, J. N.; Sosin, S.,
    Low Temperature Wafer Level Packaging of RF-MEMS Using SU-8 Contact Printing,
    Book of Abstracts 2nd International Workshop on Wafer Bonding for MEMS Technologies,
    2006
    , pp. 55-
    56
    , (2nd International Workshop on Wafer Bonding for MEMS Technologies,
    Halle, Germany,
    April)

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