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Jacopo Iannacci

Researcher
  • Phone: 0461314441
  • FBK Povo
Short bio

The field of expertise of Jacopo Iannacci is in Microsystem Technologies (MEMS) for diverse applications. He received the MSc Degree in Electronic Engineering (2003) and the PhD in Information Technology (2007) from the ARCES Research Center at the University of Bologna, Italy, and worked as Visiting Researcher (2005-2006) at the DIMES Technology Center of the Technical University of Delft, the Netherlands, on the development of packaging and integration solutions for RF-MEMS devices.

He authored and co-authored numerous scientific contributions for international journals and conference proceedings, as well as books and several book chapters in the field of MEMS and RF-MEMS technology.

In 2007 he joined the Research Staff of the Center for Materials and Microsystems (CMM) at Fondazione Bruno Kessler (FBK) in Trento, Italy. Since then he focuses on (compact) modeling, design, optimization, integration, packaging and testing for reliability of MEMS/RF-MEMS devices and networks for Sensors/Actuators, Energy Harvesting and Telecommunication systems and applications.

Research interests
RF-MEMS lumped components RF-MEMS complex networks MEMS-based Energy Harvesters MEMS Sensors and Actuators
Publications
  1. Iannacci, J.; Tschoban, C.,
    in «JOURNAL OF MICROMECHANICS AND MICROENGINEERING»,
    vol. 27,
    n. 4,
    2017
    , pp. 1 -
    11
  2. Persano, A.; Quaranta, F.; Capoccia, G.; Proietti, E.; Lucibello, A.; Marcelli, R.; Bagolini, A.; Iannacci, J.; Taurino, A.; Siciliano, P.,
    in «MICROSYSTEM TECHNOLOGIES»,
    2016
    , pp. 1 -
    6
  3. Sordo, G.; Serra, E.; Schmid, U.; Iannacci, J.,
    in «MICROSYSTEM TECHNOLOGIES»,
    vol. 22,
    2016
    , pp. 1811 -
    1820
  4. Iannacci, J.; Sordo, G.; Serra, E.; Schmid, U.,
    in «MICROSYSTEM TECHNOLOGIES»,
    vol. 22,
    n. 7,
    2016
    , pp. 1865 -
    1881
  5. Iannacci, J.; Huhn, M.; Tschoban, C.; Potter, H.,
    in «IEEE ELECTRON DEVICE LETTERS»,
    vol. 37,
    n. 10,
    2016
    , pp. 1336 -
    1339
  6. Iannacci, J.; Huhn, M.; Tschoban, C.; Potter, H.,
    in «IEEE ELECTRON DEVICE LETTERS»,
    vol. 37,
    n. 10,
    2016
    , pp. 1646 -
    1649
  7. Persano, A.; Lucibello, A.; Marcelli, R.; Capoccia, G.; Proietti, E.; Bagolini, A.; Iannacci, J.; Siciliano, P.; Quaranta, F.,
    Proc. of DTIP 2016 (Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS),
    2016
    , pp. 1-
    5
    , (DTIP 2016,
    Budapest, Hungary,
    from 30/05/2016 to 02/06/2016)
  8. Sordo, G.; Iannacci, J.; Schmid, U.,
    Proc. of DTIP 2016 (Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS),
    2016
    , pp. 213-
    216
    , (DTIP 2016,
    Budapest, Hungary,
    from 30/05/2016 to 02/06/2016)
  9. Iannacci, J.; Tschoban, C.; Reyes, J.; Maa, U.; Huhn, M.; Ndip, I.; Poetter, H.,
    Proc. of IEEE Sensors 2016,
    IEEE,
    2016
    , pp. 448-
    450
    , (IEEE SENSORS 2016,
    Orlando, Florida, USA,
    da 30/10/2016 a 02/11/2016)
  10. Iannacci, J.; Sordo, G.; Schneider, M.; Schmid, U.; Camarda, A.; Romani, A.,
    Proc. of IEEE Sensors 2016,
    IEEE,
    2016
    , pp. 464-
    466
    , (IEEE SENSORS 2016,
    Orlando, Florida, USA,
    da 30/10/2016 a 02/11/2016)

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